LED package structure and method making of the same
AssigneeHarvatek Corporation
InventorsBily Wang, Jonnie Chuang, Heng-Yen Lee, Hui-Yen Huang
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Abstract
An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative body packaging the LED die and the metallic frame. The metallic frame has a first contact corresponding to the LED die and a second contact being relative to the first contact. The first and the second contacts inside the insulative body are electrically isolated from each other. The first contact has at least one recess around the LED die, and the second contact has at least one groove formed thereon.
Claims7
An LED package structure, comprising:
- at least one LED die;
- at least one metallic frame relating to the LED die, wherein the metallic frame includes a first contact corresponding to the LED die and a second contact relative to the first contact;
- and
- an insulative body packaging the LED die and the metallic frame, wherein the first and the second contacts inside the insulative body are electrically isolated from each other;
- wherein the first contact has at least one recess around the LED die, and the second contact has at least one groove formed thereon.
7-10. (canceled)
Dependencies are inferred from the claim text.