Back to results
US 2006/0214271 A1Published application
Device and applications for passive RF components in leadframes
OwnerJeremy Loraine, Stephen Kovacicinventors
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
OwnerJeremy Loraine, Stephen Kovacicinventors
Estimating the term…
A leadframe and a semiconductor package including such a lead frame, are provided by embodiments of the invention. The leadframe includes a die flag, leads, and a radio frequency (RF) passive component integrally formed into the leadframe. Examples of the RF passive component can be an antenna, such as a spiral or serpentine antenna or one or more transmission lines that can be used as a coupler or filter. The RF passive component can also be tuned to particular frequency values and ranges depending on the particular location of attachment to the RF passive component. The semiconductor package further comprises a semiconductor die and a coupling means with which to connect to the RF passive component to another location on the leadframe, such as the leads and/or the semiconductor die. The semiconductor package may also be encapsulated in a non-conductive material to protect the semiconductor die, coupling means and RF passive component.
A semiconductor leadframe comprising a die flag, leads and an antenna, wherein the antenna is integrally formed into the leadframe.
A semiconductor leadframe comprising a die flag, leads and a coupler comprising two or more transmission lines, wherein the coupler is integrally formed into the leadframe.
A semiconductor leadframe comprising a die flag, leads and a quarter wavelength transmission line, wherein the transmission line is integrally formed into the leadframe.
A method for tuning an antenna in a leadframe, the method comprising:
A method for tuning at least one transmission line of two or more transmission lines forming a coupler in a leadframe, the method comprising:
Dependencies are inferred from the claim text.