Multilayer electronic component and manufacturing method thereof
AssigneeTDK Corporation
InventorsTatsuya Kojima, Kaname Ueda, Toru Tonogai, Raitaro Masaoka, Akinori Iwasaki, Akira Yamaguchi, Shogo Murosawa
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Abstract
Internal electrode layers are superimposed in a dielectric substrate 1 at intervals. Step absorption layers are respectively provided on lateral sides of the internal electrode layers. A side portion of the internal electrode layer forms an inclined surface, and the step absorption layer is superimposed so as to partially overlap the inclined surface of the internal electrode layer. This is also applied to the other internal electrode layers and step absorption layers.
Claims6
A multilayer electronic component comprising:
- a dielectric substrate;
- a plurality of internal electrode layers superimposed in the dielectric substrate at intervals;
- and
- step absorption layers provided on lateral sides of the internal electrode layers,
- wherein a side portion of at least one internal electrode layer forms an inclined surface, and
- at least one step absorption layer is superimposed so as to partially overlap the inclined surface.
A manufacturing method of a multilayer electronic component, comprising:
- forming an internal electrode layer on a dielectric green sheet in such a manner that a side portion thereof forms an inclined surface;
- superimposing a step absorption layer on the dielectric green sheet in such a manner that an end portion thereof partially overlaps the inclined surface;
- and
- configuring a sheet laminated body including at least one of the dielectric green sheets having the internal electrode layer and the step absorption layer formed thereon.
Dependencies are inferred from the claim text.