Back to results
US 2006/0214259 A1Published application
Hybrid chip fuse assembly having wire leads and fabrication method therefor
AssigneeCooper Technologies Company
InventorVernon Spaunhorst
Life of this patent
Estimating the term…
Abstract
A chip fuse includes a substrate, a fuse element extending on the substrate, and first and second wire leads coupled to the fuse element. Contact pads may extend over portions of the fuse element and establish electrical connection to the first and second leads. A conductive medium such as solder encircles the substrate to securely form a mechanical and electrical connection to the leads.
Claims20
A chip fuse comprising:
- a substrate;
- at least one fuse element extending on said substrate;
- and
- first and second leads coupled to said fuse element.
1 more element
A chip fuse comprising:
- a substrate layer having a first end, a second end, and opposing surfaces extending between said first end and said second end;
- first and second wire lead assemblies coupled to said fuse element layer;
- and
- at least one fuse element extending over said substrate layer and mechanically and electrically connected to said first and second lead assemblies.
1 more element
A method of fabricating a chip fuse having a fuse element layer extending on a substrate layer, said method comprising:
- forming contact pads on each of opposed surfaces of the substrate layer, at least some of the pads being in electrical contact with the fuse element;
- and
- attaching leads to the respective ends of the substrate using the contact pads.
Dependencies are inferred from the claim text.