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US 2006/0214255 A1Published application
Semiconductor device and method of manufacturing the same
AssigneeOki Data Corporation
InventorsTakahito Suzuki, Hiroyuki Fujiwara
Life of this patent
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Abstract
A semiconductor device includes a substrate, and a semiconductor thin film bonded to the substrate, wherein the semiconductor thin film includes a plurality of discrete operating regions and an element isolating region which isolates the plurality of discrete operating regions, and the element isolating region is etched to a shallower depth than a thickness of the semiconductor thin film, and is a thinner region than the plurality of discrete operating regions.
Claims5
1-12. (canceled)
A method of manufacturing a semiconductor device comprising:
- forming a semiconductor thin film including a plurality of discrete operating regions, each of which has an operating layer, on a first substrate such that said semiconductor thin film can be separated from first substrate;
- bonding said semiconductor thin film which has been separated from said first substrate to a second substrate;
- and
- forming an element isolating region by etching a region other than said plurality of discrete operating regions of said semiconductor thin film bonded to said second substrate so as to mutually isolate said operating layers of said plurality of discrete operating regions.
1 more element
Dependencies are inferred from the claim text.