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US 2006/0214247 A1Published application
Getter deposition for vacuum packaging
AssigneeHoneywell International Inc.
InventorsJon DCamp, Harlan Curtis, Max Glenn, Lisa Koland
Life of this patent
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Abstract
A device package that includes a thin film getter that is deposited on an inside surfaces of a device receiving vacuum sealed cavity or chamber. The thin film getter is deposited using, for example, sputtering, resistive evaporation, e-beam evaporation, or any other suitable deposition technique.
Claims20
A device comprising:
- a first wafer;
- one or more MEMS components fabricated on the first wafer;
- a second wafer bonded to the first wafer providing a sealed cavity for the MEMS components;
- and
- a thin film getter deposited on a surface of the second wafer that is exposed to the sealed cavity.
2 more elements
A MEMS gyroscope comprising:
- a first substrate;
- a second substrate bonded to the first substrate forming a sealed cavity formed between the first substrate and the second substrate;
- a first sense plate provided on the first substrate within the sealed cavity;
- a second sense plate provided on the second substrate within the sealed cavity;
- a device layer provided within the sealed cavity formed between the first substrate and the second substrate, the device layer having one or more MEMS components fabricated thereon;
- and
- a patterned thin film getter provided on a surface of the first substrate and on a surface of the second substrate so that the patterned thin film getter is exposed to the sealed cavity.
4 more elements
Dependencies are inferred from the claim text.