Semiconductor device and method for fabricating the same
AssigneeFujitsu Limited
InventorsTsunehisa Sakoda, Masaomi Yamaguchi, Hiroshi Minakata, Yoshihiro Sugita, Kazuto Ikeda
Life of this patent
Estimating the term…
Loading patent…
AssigneeFujitsu Limited
InventorsTsunehisa Sakoda, Masaomi Yamaguchi, Hiroshi Minakata, Yoshihiro Sugita, Kazuto Ikeda
Estimating the term…
A permeation preventing film of a silicon nitride film 16 is inserted between a silicon substrate 10 and a High-k gate insulation film 18 to thereby prevent the High-k gate insulation film 18 from being deprived of oxygen, while oxygen anneal is performed after a gate electrode layer 20 has been formed to thereby supplement oxygen. The silicon nitride film 16, which is the permeation preventing film, becomes a silicon oxide nitride film 17 without changing the film thickness, whereby characteristics deterioration of the High-k gate insulation film 18 due to the oxygen loss can be prevented without lowering the performance of the transistor. The semiconductor device having the gate insulation film formed of even a high dielectric constant material can be free from the shift of the threshold voltage.
A semiconductor device comprising:
A method for fabricating a semiconductor device including a transistor formed on a semiconductor substrate, which comprises the steps of:
A method for fabricating a semiconductor device including a p-type transitor formed in a first region of a semiconductor substrate and an n-type transitor formed in a second region of the semiconductor substrate, which comprises the steps of:
Dependencies are inferred from the claim text.