Thin-film capacitor element and semiconductor device
AssigneeFujitsu Limited
InventorsJohn Baniecki, Kenji Nomura, Takeshi Shioga, Kazuaki Kurihara
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Abstract
To provide a thin-film capacitor and a semiconductor device capable of preventing a reduction in the dielectric constant due to a residual tensile stress in a ferroelectric layer in a thin-film capacitor using the ferroelectric substance, and increasing the dielectric constant and increasing an electric capacity. In a thin-film capacitor 10 having a lower electrode 2, a ferroelectric layer 3, and an upper electrode 4 on a substrate 1, the thin-film capacitor 10 has the upper electrode 4 that adds a compressive stress to the ferroelectric layer 3, and a residual compressive stress in the upper electrode 4 is within a range from 108 to 6×1011 dyne/cm2.
Claims19
A thin-film capacitor having a lower electrode, a ferroelectric layer, and an upper electrode, wherein
- the thin-film capacitor has the upper electrode that adds a compressive stress to the ferroelectric layer.
A semiconductor device having a thin-film capacitor formed on a semiconductor substrate, wherein
- the thin-film capacitor has a lower electrode, a ferroelectric layer, and an upper layer, and
- includes the upper electrode that adds a compressive stress to the ferroelectric layer.
Dependencies are inferred from the claim text.