Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsKazutoshi Nakamura, Yusuke Kawaguchi
Life of this patent
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AssigneeKabushiki Kaisha Toshiba
InventorsKazutoshi Nakamura, Yusuke Kawaguchi
Estimating the term…
A semiconductor device comprises a semiconductor substrate of a first conductivity type; a semiconductor layer of the first type on the semiconductor substrate; a base layer of a second conductivity type on a surface of the semiconductor layer; a gate insulator formed on sidewalls of each of trenches formed through the base layer; a bottom insulator formed at a bottom of each of the trenches and extending through the semiconductor layer and into the semiconductor substrate; a gate electrode provided in each of the trenches and insulated from the semiconductor substrate, semiconductor layer and base layer by the bottom and gate insulators; source regions of the first type on a surface of the base layer; contact regions of the second type on the surface of the base layer; the bottom insulator having a thickness extending between the semiconductor substrate and the gate electrode, the gate insulator having a thickness extending between the base layer and the gate electrode, the thickness of the bottom insulator being greater than the thickness of the gate insulator, the adjacent two of the trenches each having a width greater than a distance between the adjacent two trenches.
A semiconductor device, comprising:
20 The semiconductor device as claimed in claim 1, wherein the first conductivity type is a P-type, and the second conductivity type is an N-type.
Dependencies are inferred from the claim text.