System and method for noise reduction in multi-layer ceramic packages
AssigneeInternational Business Machines Corporation
InventorsSungjun Chun, Jason Frankel, Anand Haridass, Erich Klink, Brian Singletary
Life of this patent
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Abstract
A system and method for reducing noise in a multi-layer ceramic package are provided. With the system and method, additional shielding wires are inserted into the reference planes wherever there are no signal vias present. These additional lines in the reference planes force stronger signal interaction with the reference (vdd/gnd) thereby reducing the interaction between the signals in the signal layers. As a result, the noise present in the signals of the signal layers is reduced.
Claims20
A multi-layered ceramic package, comprising:
- a plurality of signal layers, each signal layer having one or more signal lines;
- at least one reference mesh layer adjacent one or more signal layers of the plurality of signal layers;
- and
- one or more shielding reference lines provided in one or more reference mesh layers of the at least one reference mesh layer, wherein the one or more shielding reference lines force a stronger interaction between themselves and the one or more signal lines than an interaction between signal lines of different signal layers.
A method of fabricating a multi-layered ceramic package, comprising:
- receiving an unshielded multi-layered ceramic package design, wherein the unshielded multi-layered ceramic package design includes a plurality of signal layers and at least one reference mesh layer adjacent one or more signal layers of the plurality of signal layers;
- inserting, into the unshielded multi-layered ceramic package design, additional shielding reference lines into the at least one reference mesh layer to generate a shielded multi-layered ceramic package design;
- and
- fabricating the multi-layered ceramic package based on the shielded multi-layered ceramic package design.
A system for fabricating a multi-layered ceramic package, comprising:
- a multi-layered ceramic package design system that provides an unshielded multi-layered ceramic package design, wherein the unshielded multi-layered ceramic package design includes a plurality of signal layers and at least one reference mesh layer adjacent one or more signal layers of the plurality of signal layers;
- a shielding signal line insertion engine that inserts, into the unshielded multi-layered ceramic package design, additional shielding reference lines into the at least one reference mesh layer to generate a shielded multi-layered ceramic package design;
- and
- a ceramic package fabrication system that fabricates the multi-layered ceramic package based on the shielded multi-layered ceramic package design.
Dependencies are inferred from the claim text.