Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorKer-Min Chen
Life of this patent
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Abstract
A semiconductor device including a plurality of input/output cells and having a first bond pad and at least one second bond pad coupled to each input/output cell. The first bond pads comprise a first pattern, and the at least second bond pads comprise at least one second pattern, wherein the at least one second pattern is different from or the same as the first pattern. Either the first bond pads, the at least second bond pads, or both, may be used to electrically couple the input/output cells of the semiconductor device to leads of an integrated circuit package or other circuit component.
Claims26
A semiconductor device, comprising:
- a workpiece;
- a plurality of active areas formed in the workpiece;
- a plurality of input/output cells formed over the plurality of active areas, wherein each input/output cell is electrically coupled to one of the plurality of active areas;
- and
- a bond pad layer disposed over the input/output cells, wherein the bond pad layer comprises:
- a first plurality of bond pads, disposed in a first pattern;
- and
- at least a second plurality of bond pads, disposed in a second pattern;
- and
- wherein each input/output cells, each input/output cell is coupled to a first bond pad and a second bond pad from, respectively, the first plurality of bond pads and the at least second plurality of bond pads;
- and wherein the electrically couple the input/output cell to a common connection external to the semiconductor device.
A method of manufacturing a semiconductor device, the method comprising:
- providing a workpiece;
- forming active areas over or within the workpiece;
- forming a plurality of input/output cells over at least one active area;
- coupling a first bond pad and at least one second bond pad to each input/output cell;
- wherein coupling the first bond pads comprises forming the first bond pads in a first pattern, wherein coupling the at least one second bond pads comprises forming the second bond pads in at least one second pattern, the at least one second patterns being different from the first pattern;
- and
- wherein each first bond pad and each at least one second bond pad are adapted to couple the semiconductor device to a common connection external to the semiconductor device.
A method of fabricating an integrated circuit die, comprising:
- forming a plurality of input/output cells in a substrate;
- forming a plurality of first bond pads disposed over the input/output cells in a first pattern, wherein each first bond pad is electrically coupled to one of the underlying input/output cells;
- and
- forming a plurality of second bond pads disposed proximate the input/output cells in a second pattern, each second bond pad being spaced apart from and disposed near a side of an input/output cell, each second bond pad being electrically coupled to one of the input/output cells, wherein the second pattern is different from the first pattern.
Dependencies are inferred from the claim text.