Light emitting diode package and fabrication method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSang Choi, Woong Hwang, Seog Choi, Ho Park, Sung Lee, Chang Lim
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Abstract
The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.
Claims19
A light emitting diode package comprising:
- a lower metal layer;
- a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer and a package electrode pattern formed in their order on the lower metal layer;
- a spacer having a cavity, formed on the package electrode pattern;
- an LED mounted in the cavity, flip-chip bonded to the package electrode pattern;
- and
- an optical element adhered to the upper surface of the spacer.
A fabrication method of a light emitting diode package comprising steps of:
- preparing a submount substrate formed of a first silicon layer, a first insulation layer, a second silicon layer, and a second insulation layer deposited in their order;
- selectively etching the first silicon layer to form a groove exposing the first insulation layer in an area corresponding to a mounting area of an LED;
- forming a lower metal layer on the exposed surface of the first insulation layer and a lower surface of the first silicon layer to fill up the groove;
- forming a package electrode pattern on the second insulation layer, and mounting the LED on the package electrode pattern by flip-chip bonding;
- providing a spacer having a cavity on the package electrode pattern to receive the LED in the cavity;
- and
- adhering an optical element to the upper surface of the spacer.
A fabrication method of light emitting diode packages comprising steps of:
- preparing a submount substrate formed of a first silicon layer, a first insulation layer, a second silicon layer, and a second insulation layer deposited in their order;
- selectively etching the first silicon layer to form a plurality of grooves exposing the first insulation layer in areas corresponding to mounting areas of a plurality of LEDs;
- forming a lower metal layer on the exposed surface of the first insulation layer and the lower surface of the first silicon layer to fill up the plurality of grooves;
- forming a plurality of package electrode patterns on the second insulation layer, and mounting the plurality of LEDs on the package electrode pattern by flip-chip bonding;
- providing a spacer having a plurality of cavities on the plurality of package electrode patterns so that each LED is received in each cavity;
- adhering an optical element to the upper surface of the spacer;
- and
- dicing the resultant structure with the optical element into a plurality of LED packages.
Dependencies are inferred from the claim text.