Semiconductor light-emitting element and light-emitting device
AssigneeKabushiki Kaisha Toshiba
InventorsShinji Saito, Shinya Nunoue
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Abstract
A semiconductor light-emitting element has a laminated section which has an active layer made of a semiconductor, and first and second clad layers each being disposed to sandwich the active layer and made of a semiconductor, a pair of first high-reflection layers each being disposed to sandwich the active layer in a first direction orthogonal to the laminated direction of the laminated section, and a low-reflection layer and a second high-reflection layer each being disposed to sandwich the active layer in a second direction orthogonal to the laminated direction and crossing to the first direction.
Claims21
A semiconductor light-emitting element, comprising:
- a laminated section which has an active layer made of a semiconductor, and first and second clad layers each being disposed to sandwich the active layer and made of a semiconductor;
- a pair of first high-reflection layers each being disposed to sandwich the active layer in a first direction orthogonal to the laminated direction of the laminated section, which have high reflectance relative to a light emitted by the active layer;
- and
- a low-reflection layer and a second high-reflection layer each being disposed to sandwich the active layer in a second direction orthogonal to the laminated direction and crossing to the first direction, which have low reflectance and high reflectance respectively relative to the light emitted by the active layer.
A light-emitting device, comprising:
- a mount substrate which has a heat sink;
- and
- a semiconductor light-emitting element mounted on the heat sink,
- the semiconductor light-emitting element comprising:
- a laminated section which has an active layer made of a semiconductor, and first and second clad layers each being disposed to sandwich the active layer and made of a semiconductor;
- a pair of first high-reflection layers each being disposed to sandwich the active layer in a first direction orthogonal to the laminated direction of the laminated section, which have high reflectance relative to a light emitted by the active layer;
- and
- a low-reflection layer and a second high-reflection layer each being disposed to sandwich the active layer in a second direction orthogonal to the laminated direction and crossing to the first direction, which have low reflectance and high reflectance respectively relative to the light emitted by the active layer,
- the laminated direction of the laminated section being in parallel to a surface of the heat sink on which the semiconductor light-emitting element is disposed.
A method of fabricating a semiconductor light-emitting device, comprising:
- forming on a semiconductor substrate a laminated section which has a active layer made of a semiconductor, and first and second clad layers each being disposed to sandwich the active layer and made of a semiconductor;
- forming a plurality of resist patterns of the same size on an upper surface of the laminated section;
- performing a first cleavage in a direction that electrodes or openings of an insulator formed by using the resist patterns are disposed, along a first direction corresponding to a direction of cleavage of the semiconductor substrate;
- forming a pair of first high-reflection layers which have high reflectance relative to a light emitted by the active layer on two opposite surfaces obtained by the first cleavage;
- performing a second cleavage between two adjacent electrodes or two adjacent openings of the insulator, along a second direction crossing to the first direction;
- and
- forming a low-reflection layer and a second high-reflection layer which have low reflectance and high reflectance respectively relative to the light emitted by the active layer on two opposite surfaces obtained by the second cleavage.
A method of fabricating a semiconductor light-emitting device, comprising:
- forming on a semiconductor substrate a laminated section which has a active layer made of a semiconductor, and first and second clad layers each being disposed to sandwich the active layer and made of a semiconductor;
- forming a plurality of resist patterns of the same size on an upper surface of the laminated section;
- performing a first cleavage in a direction that electrodes or openings of an insulator formed by using the resist patterns are disposed, along a first direction corresponding to a direction of cleavage of the semiconductor substrate;
- forming a low-reflection layer and a first high-reflection layer which have low reflectance and high reflectance respectively relative to the light emitted by the active layer on two opposite surfaces obtained by the first cleavage;
- performing a second cleavage between two adjacent electrodes or two adjacent openings of the insulator, along a second direction crossing to the first direction;
- and
- forming a pair of second high-reflection layers which have high reflectance relative to the light emitted by the active layer on two opposite surfaces obtained by the second cleavage.
Dependencies are inferred from the claim text.