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US 2006/0214165 A1Published application
Optimized circuits for three dimensional packaging and methods of manufacture therefore
AssigneeParatek Microwave, Inc.
InventorsWilliam Macropoulos, Greg Mendolia, James Oakes, Izz Khayo
Life of this patent
Estimating the term…
Abstract
An apparatus, comprising an integrated circuit, wherein a first portion of the integrated circuit is placed on a first substrate and a second portion of the integrated circuit is placed on a second substrate stacked adjacent the first substrate and wherein the first portion and the second portion of the integrated circuit are interconnected.
Claims23
An apparatus, comprising:
- an integrated circuit, wherein a first portion of said integrated circuit is placed on a first substrate and a second portion of said integrated circuit is placed on a second substrate stacked adjacent said first substrate and wherein said first portion and said second portion of said integrated circuit are interconnected.
A method, comprising:
- placing a first portion of an integrated circuit on a first substrate;
- placing a second portion of an integrated circuit on a second substrate that stacked adjacent said first substrate;
- and
- interconnecting said first portion and said second portion of said integrated circuit.
1 more element
An integrated circuit, comprising:
- a first portion including at least one output match connected to at least one harmonic filter on a first substrate;
- a second portion on a second substrate positioned adjacent said first substrate and including at least one power amplifier connected to at least one bias and power controller which is further connected to an antenna switch;
- and
- wherein said first and second substrates further comprise at least one interconnect connecting said first portion and said second portion.
1 more element
Dependencies are inferred from the claim text.