Method for producing a wire connection
AssigneeUnaxis International Trading Ltd.
InventorShui Yu
Life of this patent
Estimating the term…
Abstract
A method for producing a wire connection between a semiconductor chip and a substrate with which the end of a wire protruding out of a capillary of a Wire Bonder is melted into a wire ball, attached to a first connection point on the semiconductor chip, pulled out to the required length and attached to a second connection point on the substrate is characterized in that, after attaching the wire ball to the first connection point on the semiconductor chip the capillary is first raised by a predetermined distance D1 and then moved by a predetermined distance D2 in horizontal or inclined upward direction and in the direction towards the second connection point on the substrate. The distances D1 and D2 amount typically to once to twice the diameter of the wire.
Claims4
Method for producing a wire connection between a semiconductor chip and a substrate according to the steps of:
- a) melting an end of a wire protruding out of a capillary of a Wire Bonder into a wire ball,
- b) attaching the ball to a first connection point on the semiconductor chip,
- c) raising the capillary by a predetermined distance D1, the distance D1 amounting to a value of once to twice a diameter of the wire,
- d) moving the capillary by a predetermined distance D2 in horizontal or inclined upward direction and in direction towards the second connection point on the substrate, the distance D2 amounting to a value of once to twice the diameter of the wire,
- e) raising the capillary and moving the capillary for forming a wire loop and attaching the wire to a second connection point on the substrate.
Dependencies are inferred from the claim text.