Method for controlling a CMP process and polishing cloth
AssigneeInfineon Technologies AG
InventorRoland Rzehak
Life of this patent
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Abstract
The invention relates to a method for controlling a CMP process with a polishing cloth, by which a surface of a substrate is polished, the polishing procedure being controlled on the basis of at least one process parameter, allowance for a height distribution of the surface of the polishing cloth, in particular a range of the height distribution, being made in the control of the CMP process. Furthermore, the invention relates to a polishing cloth for a CMP process with a surface which has a height distribution, the height distribution having a range which is less than 3 μm.
Claims11
A method for controlling a CMP process with a polishing cloth, comprising:
- polishihg a surface of a substrate, the polishing controlled based on of at least one process parameter;
- and
- allowing for a height distribution of the surface of the polishing cloth in control of the CMP process.
A method for determining a polishing performance of a CMP process of a substrate with a polishing cloth, comprising:
- subjecting an upper surface and a set-back surface of the substrate to a polishing procedure with the polishing cloth;
- and
- allowing a height distribution of a surface of the polishing cloth to be made in the determination of the polishing performance for the upper surface and/or the set-back surface.
A method for controlling a conditioning procedure for a polishing cloth in a CMP process, comprising:
- polishing a surface of the substrate with a polishing cloth, the polishing cloth being subjected to a conditioning procedure, the polishing cloth being worked with a conditioning device during the conditioning procedure to produce a desired surface property of the polishing cloth;
- and
- allowing a height distribution of a surface of the polishing cloth to be made for the beginning and/or the control of the conditioning procedure.
A polishing cloth for a CMP process with a surface which has a height distribution, the height distribution having a range which is less than 3 μm.
Dependencies are inferred from the claim text.