Tribo-chronoamperometry as a tool for CMP application
AssigneeCabot Microelectronics Corporation
InventorsJian Zhang, Steve Grumbine, Phillip Carter
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Abstract
The invention provides a method of determining at least one electrochemical characteristic of a chemical-mechanical or electrochemical-mechanical polishing system comprising application of a potential between a polishing substrate and an electrode to generate a current, and determining the at least one electrochemical characteristic by analysis of the current as a function of time.
Claims36
A method of determining at least one electrochemical characteristic of a chemical-mechanical polishing system comprising (a) a reactive substrate and (b) an aqueous solution, the method comprising:
- (i) providing an electrochemical cell comprising:
- (a) a reactive substrate comprising at least one conductive material,
- (b) an aqueous solution with a conductivity of about 10 μS or more, and
- (c) an electrode,
- wherein the reactive substrate and the electrode are in fluid communication with the aqueous solution, and wherein a first potential exists between the reactive substrate and the electrode,
- (ii) changing the first potential to a second potential, wherein the second potential is different than the first potential, such that a current is generated between the reactive substrate and the electrode,
- (iii) collecting data wherein the data comprise an electrochemical cell current,
- (iv) determining the at least one electrochemical characteristic of the chemical-mechanical polishing system by analysis of the data, and
- (v) determining at least one polishing characteristic of the chemical-mechanical polishing system using the at least one electrochemical characteristic of the chemical-mechanical polishing system.
A method of determining at least one electrochemical characteristic of a electrochemical-mechanical polishing system comprising (a) a reactive substrate and (b) an aqueous solution, the method comprising:
- (i) providing an electrochemical cell comprising:
- (a) a reactive substrate comprising at least one conductive material,
- (b) an aqueous solution with a conductivity of about 10 μS or more, and
- (c) an electrode,
- wherein the reactive substrate and the electrode are in fluid communication with the aqueous solution, and wherein a first potential exists between the reactive substrate and the electrode,
- (ii) applying a first potential between the reactive substrate and the electrode,
- (iii) changing the first potential to a second potential, wherein the second potential is different than the first potential, such that a current is generated between the reactive substrate and the electrode,
- (iv) collecting data wherein the data comprise the electrochemical cell current, and
- (v) determining the at least one electrochemical characteristic of the electrochemical-mechanical polishing system by analysis of the data.
An electrochemical-mechanical polishing apparatus comprising:
- (a) a platen that rotates,
- (b) a carrier that holds a workpiece to be polished,
- (c) a conductive polishing pad,
- (d) a first electrode, wherein the conductive polishing pad and the first electrode are electrically connected to means for applying a potential between the first electrode and the conductive polishing pad,
- (e) an aqueous solution having a conductivity of about 10 AS or more, and
- (f) a second electrode.
Dependencies are inferred from the claim text.