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US 2006/0213780 A1Published application
Electroplating composition and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChien-Hsueh Shih, Hung-Wen Su
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Abstract
Electroplating composition and method. In one embodiment, the composition comprises an electrolyte solution and an amine-based copolymer comprising monomer units of ethylene oxide and propylene oxide, with the propylene oxide present in a quantity of at least about 70 wt %. The method comprises electroplating a metal onto a substrate from the electroplating composition of the invention.
Claims21
An electroplating composition, comprising:
- an electrolyte solution;
- and
- an amine-based copolymer comprising monomer units of ethylene oxide and propylene oxide in the electrolyte solution, wherein the propylene oxide is present in the copolymer in a quantity of at least about 70 wt %.
An electroplating composition, comprising:
- an electrolyte solution;
- an amine-based copolymer comprising monomer units of ethylene oxide and propylene oxide in the electrolyte solution as a first suppressor additive, wherein the propylene oxide is present in the amine-based copolymer in a quantity of at least about 70 wt %;
- and
- a copolymer comprising monomer units of ethylene oxide and propylene oxide in the electrolyte solution as a second suppressor additive, wherein the ethylene oxide is present in the copolymer in a quantity of at least about 60 wt %.
1 more element
Dependencies are inferred from the claim text.