Cylindrical sputtering apparatus
AssigneeNanoset, LLC
InventorXingwu Wang
Life of this patent
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Abstract
A cylindrical sputtering target including a cylinder of a first material wherein the inner wall of the cylinder has embedded within it a pattern of small pieces of one or more different materials, whereby such target produces a spatially and compositionally uniform coating on a substrate in a cylindrical sputtering process. The molar ratio of the multiple materials in the coating composition is influenced by the size, shape, and geometrical pattern of the material pieces embedded in the inner cylinder wall.
Claims28
A cylindrical magnetron sputter coating device, comprising:
- a cylindrical cathode;
- a cylindrical target disposed within said cylindrical cathode, said cylindrical target comprised of a first material and having an inner wall and an outer wall;
- a plurality of chips or pieces disposed on said inner wall, said chips or pieces comprised of a second material.
A process for sputter coating, in a cylindrical magnetron sputtering device, a compound coating on a three dimensional substrate, said process comprising:
- providing a cylindrical target comprised of a first material, said cylindrical target having an inner wall, said inner wall having disposed thereon a plurality of chips or pieces, said chips or pieces comprised of a second material.
A cylindrical target for a magnetron sputter coating device, comprising:
- a first material having an inner wall and an outer wall;
- a plurality of chips or pieces disposed on said inner wall, said chips or pieces comprised of at least a second material.
Dependencies are inferred from the claim text.