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US 2006/0213648 A1Published application
Method for manufacturing heat dissipation apparatus
AssigneeDelta Electronics, Inc.
InventorsYency Chen, Hsin-Chang Tsai, Horng-Jou Wang, Chi-Feng Lin, Chin-Ming Chen
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Abstract
A method for manufacturing a heat dissipation apparatus comprises the following steps: A substrate is provided. A pressure is exerted on the substrate by a roller mold to form a plurality of grooves on one surface of the substrate. A sealed chamber is formed out of the substrate so that the grooves are formed on an inner wall of the sealed chamber.
Claims20
A method for manufacturing a heat dissipation apparatus, comprising the steps of:
- providing a substrate;
- exerting a pressure on the substrate by a roller mold to form a plurality of grooves on a surface of the substrate;
- and
- forming a sealed chamber out of the substrate so that the grooves are formed on an inner wall of the sealed chamber.
1 more element
A method for manufacturing a heat dissipation apparatus, comprising the steps of:
- providing a plurality of substrates;
- exerting a pressure on at least one substrate of the substrates by a roller mold to form a plurality of the grooves on a surface of the at least one substrate;
- and
- forming a sealed chamber out of the plurality of substrates so that the grooves are formed on an inner wall of the sealed chamber.
1 more element
Dependencies are inferred from the claim text.