Plasma enhanced atomic layer deposition system

A plasma enhanced atomic layer deposition (PEALD) system comprising:

• a first chamber component coupled to a second chamber component to provide a processing chamber defining an isolated processing space within the processing chamber;
• means provided within said processing chamber for supporting a substrate;
• means for supplying a first process material to said processing chamber;
• means for supplying a second process material to said processing chamber;
• means for generating and coupling electromagnetic power to the processing chamber while said second process material supply system supplies the second process material to the process chamber, in order to accelerate a reduction reaction at a surface of said substrate;
• and
• means for impeding external contaminants that permeate said chamber from traveling to a region of said substrate holder, wherein said film is formed on said substrate by alternatively introducing said first process material and said second process material.