Thermoelectric conversion module and electronic device
AssigneeAisin Seiki Kabushiki Kaisha
InventorAkihiro Morimoto
Life of this patent
Estimating the term…
Abstract
A thermoelectric conversion module includes a first insulated substrate formed in a plate shape, a second insulated substrate formed in a plate shape, the first insulated substrate and the second insulated substrate are provided so as to be paired, plural thermoelectric elements provided between the insulated substrates so as to be joined thereto, a first object joined to the first insulated substrate in a manner where the first object is cooled and a second object joined to the second insulated substrate in a manner where the second object is heated, wherein a thickness of the first insulated substrate is set on the basis of a linear expansion of the first object, and a thickness of the second insulated substrates is set on the basis of a linear expansion of the second object.
Claims6
A thermoelectric conversion module comprising:
- a first insulated substrate formed in a plate shape;
- a second insulated substrate formed in a plate shape;
- the first insulated substrate and the second insulated substrate being provided so as to be paired;
- plural thermoelectric elements provided between the insulated substrates so as to be joined thereto;
- a first object joined to the first insulated substrate in a manner where the first object is cooled;
- and
- a second object joined to the second insulated substrate in a manner where the second object is heated, wherein a thickness of the first insulated substrate is set on the basis of a linear expansion of the first object, and a thickness of the second insulated substrates is set on the basis of a linear expansion of the second object.
An electronic device comprising:
- a package including a bottom plate;
- a mount to which an element, which needs to be controlled in its temperature, is mounted;
- a first insulated substrate joined to the mount;
- a second insulated substrate joined to the bottom plate of the package;
- plural thermoelectric elements provided between the first insulated substrate and the second insulated substrate so as to be joined thereto in order to cool the mount and to emit heat to the bottom plate of the package while power applied, wherein a thickness of the first insulated substrate is set on the basis of a linear expansion of the mount, and a thickness of the second insulated substrate is set on the basis of a linear expansion of the bottom plate of the package.
Dependencies are inferred from the claim text.