Circuit board for surface-mount device to be mounted thereon

A method for soldering a surface-mount device (SMD) on a circuit board, the circuit board comprising a substrate having a top surface and a bottom surface opposite to the top surface, the SMD comprising a set of pins to be soldered on a set of conductors formed on the top surface of the circuit board, each pin being respectively corresponding to one conductor, said method comprising the steps 6f:

• (a) forming a hole through the substrate of the circuit board and adjacent to the set of conductors;
• (b) disposing the SMD on the top surface of the substrate such that the set of pins is aligned with the set of conductors;
• (c) soldering the set of pins on the set of conductors by reflowing;
• (d) checking whether each pin is electrically-connected with the corresponding conductor, if NO, executing step (e);
• and
• (e) re-soldering the pin that is electrically-disconnected with the corresponding conductor by a welder, wherein during the process of re-soldering, the welder passes from the bottom surface to the top surface through said hole.

A method for soldering a surface-mount device (SMD) on a circuit board, the circuit board comprising a substrate having a top surface and a bottom surface opposite to the top surface, the SMD comprising a pin to be soldered on a first position at the top surface of the substrate, said method comprising the steps of:

• forming a hole at a second position at the top surface and through the substrate, said second position being adjacent to the first position;
• disposing the SMD on the top surface of the substrate such that the pin is aligned with the first position;
• and
• soldering the pin on said first position with a welder, wherein during the process of soldering, the welder passes from the bottom surface to the top surface through said hole.