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US 2006/0213053 A1Published application
Double layer patterning and technique for milling patterns for a servo recording head
AssigneeAdvanced Research Corporation
InventorsMatthew Dugas, Joseph Tersteeg
Life of this patent
Estimating the term…
Abstract
Double photolithography is used to produce an under-layer of protective and filtering photoresist over a substrate that will have channels milled with a FIB. Secondary layers are applied with precision on top of the first layer in order to define the precise patterns to be milled and to provide targeting and alignment fiducials.
Claims27
1-58. (canceled)
A method comprising:
- providing a first layer of photoresist on a substrate to form a protective layer, wherein the first layer of photoresist is provided over substantially all of an upper surface of the substrate except for at least one predefined area of the substrate that is exposed to provide grounding for a milling device;
- hard baking the first layer of photoresist prior to applying a second layer of photoresist;
- providing the second layer of photoresist on an upper surface of the first layer to define a target area;
- and
- milling the target area with the milling device.
2 more elements
A method comprising:
- providing a first layer of photoresist on a substrate to form a protective layer, wherein the first layer of photoresist is provided over substantially all of an upper surface of the substrate;
- hard baking the first layer of photoresist prior to applying a second layer of photoresist;
- providing the second layer of photoresist on an upper surface of the first layer to define a target area, the second layer of photoresist defining a writing gap for a magnetic recording head;
- and
- milling the target area with a milling device.
2 more elements
A method comprising:
- providing a first layer of photoresist on a substrate to form a protective layer, wherein the first layer of photoresist is provided over substantially all of an upper surface of the substrate;
- hard baking the first layer of photoresist prior to applying a second layer of photoresist;
- providing the second layer of photoresist on an upper surface of the first layer to define a target area, the second layer of photoresist defining a timing based writing gap for a magnetic recording head;
- and
- milling the target area with a milling device.
2 more elements
A method comprising:
- providing a first layer of photoresist on a substrate to form a protective layer, wherein the first layer of photoresist is provided over substantially all of an upper surface of the substrate;
- hard baking the first layer of photoresist prior to applying a second layer of photoresist;
- providing the second layer of photoresist on an upper surface of the first layer to define a target area;
- positioning the first and second layer of photoresist such that milling the target area comprises milling boundaries through photoresist despite beam shifting;
- and
- milling the target area with a milling device.
3 more elements
A method comprising:
- providing a first layer of photoresist on a substrate to form a protective layer, wherein the first layer of photoresist is provided over substantially all of an upper surface of the substrate;
- hard baking the first layer of photoresist prior to applying a second layer of photoresist;
- providing the second layer of photoresist on an upper surface of the first layer to define a target area, wherein the second layer includes at least one fiducial mark for aligning an orientation of a milling device;
- and
- milling the target area with the milling device.
2 more elements
A method comprising:
- providing a first layer of photoresist on a substrate to form a protective layer, wherein the first layer of photoresist is provided over substantially all of an upper surface of the substrate;
- hard baking the first layer of photoresist prior to applying a second layer of photoresist;
- providing the second layer of photoresist on an upper surface of the first layer to define a target area;
- and
- milling the target area with a milling device, wherein the milling device is a focused ion beam.
2 more elements
A method comprising:
- providing a first layer of photoresist on a substrate to form a protective layer, wherein the first layer of photoresist is provided over substantially all of an upper surface of the substrate;
- hard baking the first layer of photoresist prior to applying a second layer of photoresist;
- providing the second layer of photoresist on an upper surface of the first layer to define a target area;
- depositing a layer of conductive material over the first and the second layer of the photoresist;
- and
- milling the target area with a milling device.
3 more elements
A method comprising:
- providing a first layer of photoresist on a substrate to form a protective layer, wherein the first layer of photoresist is provided over substantially all of an upper surface of the substrate;
- hard baking the first layer of photoresist prior to applying a second layer of photoresist;
- providing the second layer of photoresist on an upper surface of the first layer to define a target area, wherein the target area is an identifiable mark to provide an origin for a coordinate system;
- and
- milling the target area with a milling device.
2 more elements
Dependencies are inferred from the claim text.