US 2006/0200979 A1 · Component mounting method

Abstract

Disclosed is a component mounting method. Moved in first and second orthogonal directions is a first mounting head section having first nozzles. The first mounting head is rotated such that the first nozzles rotate and successively pickup components from a first component supply table arranged on one side of a board transfer path. These components are then successively mounted onto a board positioned in the board transfer path. Moved in third and fourth orthogonal directions is a second mounting head section having second nozzles. The second mounting head section is rotated such that the second nozzles rotate and successively pickup components from a second component supply table arranged on an opposite side of the board transfer path. These components are then successively mounted onto the board while positioned in the board transfer path.

Claims10

Dependent claims

1-2. (canceled)

A component mounting method comprising:

providing component mounting stations positioned along a board transfer path, each of said mounting stations including first and second mounting head sections and first and second component supply tables, each of said first mounting head sections having first nozzles, and each of said second mounting head sections having second nozzles;
delivering a board to said board transfer path;
at one of said component mounting stations, moving a corresponding one of said first mounting head sections in first and second orthogonal directions, rotating said corresponding one of said first mounting head sections such that said first nozzles of said corresponding one of said first mounting head sections rotate, and successively picking up components from a corresponding one of said first component supply tables arranged on one side of said board transfer path, with said first direction being perpendicular to said board transfer path and said second direction extending along said board transfer path;
then
successively mounting onto said board, positioned in said board transfer path, the components picked up by said first nozzles of said corresponding one of said first mounting head sections;
at said one of said component mounting stations, moving a corresponding one of said second mounting head sections in third and fourth orthogonal directions, rotating said corresponding one of said second mounting head sections such that said second nozzles of said corresponding one of said second mounting head sections rotate, and successively picking up components from a corresponding one of said second component supply tables arranged on an opposite side of said board transfer path, with said third direction being parallel to said first direction and said fourth direction being parallel to said second direction;
then
successively mounting onto said board, positioned in said board transfer path, the components picked up by said second nozzles of said corresponding one of said second mounting head sections,
wherein at least one of said component supply tables is mounted on casters.

6 more elements

A component mounting method comprising:

providing component mounting stations positioned along a board transfer path, each of said mounting stations including first and second mounting head sections and first and second component supply tables, each of said first mounting head sections having first nozzles, and each of said second mounting head sections having second nozzles;
delivering a board to said board transfer path;
at one of said component mounting stations, moving a corresponding one of said first mounting head sections in first and second orthogonal directions, rotating said corresponding one of said first mounting head sections such that said first nozzles of said corresponding one of said first mounting head sections rotate, and successively picking up components from a corresponding one of said first component supply tables arranged on one side of said board transfer path, with said first direction being perpendicular to said board transfer path and said second direction extending along said board transfer path;
then
successively mounting onto said board, positioned in said board transfer path, the components picked up by said first nozzles of said corresponding one of said first mounting head sections;
at said one of said component mounting stations, moving a corresponding one of said second mounting head sections in third and fourth orthogonal directions, rotating said corresponding one of said second mounting head sections such that said second nozzles of said corresponding one of said second mounting head sections rotate, and successively picking up components from a corresponding one of said second component supply tables arranged on an opposite side of said board transfer path, with said third direction being parallel to said first direction and said fourth direction being parallel to said second direction;
then
successively mounting onto said board, positioned in said board transfer path, the components picked up by said second nozzles of said corresponding one of said second mounting head sections,
wherein
(i) rotating said corresponding one of said first mounting head sections comprises rotating said corresponding one of said first mounting head sections around a horizontal axis, or
(ii) rotating said corresponding one of said second mounting head sections comprises rotating said corresponding one of said second mounting head sections around a horizontal axis.

8 more elements

Dependencies are inferred from the claim text.

Facts

Application

11/433,357Filed 15 May 2006

Priority

JP 7-2869696 Nov 1995

Published

14 Sep 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification20 codes

H05K 13/0411
Pick-and-place heads or apparatus, e.g. with jaws: having multiple mounting heads
Y10S 29/044
Metal working: vacuum
Y10T 29/4913
On flat or curved insulated base, e.g., printed circuit, etc.: assembling to base an electrical component, e.g., capacitor, etc.
Y10T 29/49131
Assembling to base an electrical component, e.g., capacitor, etc.: by utilizing optical sighting device

Family

Application08/740,992Continuation · filed 5 Nov 1996

Application09/010,490Division · filed 21 Jan 1998

Application09/010,490Continuation · filed 21 Jan 1998

Application10/882,399Continuation · filed 2 Jul 2004

Application10/882,399Division · filed 2 Jul 2004

Application11/433,357Continuation · filed 15 May 2006

US 2004/0237297 A1Published application

US 5,778,525 ARelated patent

US 6,789,310 B1Related patent

US 7,069,648 B2Related patent

US 7,200,925 B2Related patent