Method and apparatus for mounting and removing an electronic component

A removing apparatus for an electronic component mounted on a substrate with the use of solder bumps, the removing apparatus comprising:

• a heating unit heating a tool supporting the electronic component or heating at least a soldered portion of the electronic component;
• a contact detection unit detecting contact of the tool with the electronic component on the substrate;
• a movement mechanism for moving the tool;
• and
• a control unit moving the tool via the movement mechanism to detect the contact by use of the contact detection unit, the control unit raising a heating temperature for the electronic component and the substrate via the heating unit up to a maximum heating temperature starting from the contact, the control unit moving the tool via the movement mechanism responding to the temperature rising, the control unit moving the electronic component through movement of the tool from a position where the maximum heating temperature is achieved to a mounting height of the substrate so that the tool receives the electronic component from the substrate.