Semiconductor substrate processing method and apparatus
AssigneeReVera Incorporated
InventorAlger Pike
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AssigneeReVera Incorporated
InventorAlger Pike
Estimating the term…
According to one aspect of the invention, a semiconductor substrate processing apparatus and a method for processing semiconductor substrates are provided. The method may include providing a semiconductor substrate having a surface and a plurality of features on the surface, each feature being positioned on the surface at a first respective point in a first coordinate system, plotting the position of each feature at a second respective point in a second coordinate system; and generating a translation between the first and the second coordinate systems. The generating of the translation may include calculating an offset between the first and the second coordinate systems. The calculating of the offset may include calculating an offset distance between a reference point of the first coordinate system and a reference point of the second coordinate system and calculating an offset angle between an axis of the first coordinate system and an axis of the second coordinate system.
A method comprising:
The method of claim 11, wherein said movement of the second semiconductor substrate is performed by a robotic arm, the second semiconductor substrate entering the chamber at the first portion, the robotic arm moving the second semiconductor substrate from the first portion of the chamber to the second portion of the chamber, said propagation of the electromagnetic radiation taking place in the second portion of the chamber.
A computer readable medium having a set of instructions stored thereon, which when executed by a processor, cause a method to be performed, the method comprising:
A semiconductor substrate processing system comprising:
A method comprising:
Dependencies are inferred from the claim text.