Method and apparatus for identifying a manufacturing problem area in a layout using a process-sensitivity model

A computer-readable storage medium storing instructions that when executed by a computer cause the computer to perform a method for identifying an area in a mask layout which is likely to cause manufacturing problems, the method comprising:

• creating an on-target process model that models a semiconductor manufacturing process under nominal (e.g., optimal) process conditions;
• creating one or more off-target process models that model the semiconductor manufacturing process under one or more arbitrary (e.g., non-optimal) process conditions;
• computing a process-sensitivity model using the on-target process model and the one or more off-target process models, wherein the process-sensitivity model can be represented by a multidimensional function;
• and
• identifying a problem area in the mask layout using the process-sensitivity model, wherein identifying the problem area allows it to be corrected, thereby improving the manufacturability of the mask layout;
• wherein using the process-sensitivity model to identify the problem area reduces the computational time required to identify the problem area.

A method for identifying a manufacturing problem area in an uncorrected, partially corrected, or completely corrected mask layout using a process-sensitivity model, the method comprising:

• computing a problem-indicator by convolving a first multidimensional function that represents the process-sensitivity model with a second multidimensional function that represents the mask layout;
• and
• identifying the manufacturing problem area in the mask layout using the problem-indicator;
• wherein the first multidimensional function captures all the process-sensitivity information, thereby substantially reducing the amount of computation required for identifying the manufacturing problem area.