Semiconductor integrated circuit for reducing number of contact pads to be probed in probe test
AssigneeNEC Electronics Corporation
InventorsShinichi Nakatsu, Hideo Isogai, Takehiro Masumoto, Kazuyuki Nishizawa, Toshihide Tsuboi, Kimiharu Etou
Life of this patent
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Abstract
A semiconductor chip is composed of first and second contact pads; a first latch circuit connected with the first contact pad; a second latch circuit connected with the second contact pads; an internal circuit electrically connected with the first and second latch circuits; and a control circuit controlling data transfer between the first and second latch circuits. The area of the first contact pad is larger than that of the second contact pad.
Claims10
A semiconductor chip comprising:
- first and second contact pads;
- a first latch circuit connected with said first contact pad;
- a second latch circuit connected with said second contact pads;
- an internal circuit electrically connected with said first and second latch circuits;
- and
- a control circuit controlling data transfer between said first and second latch circuits,
- wherein an area of said first contact pad is larger than that of said second contact pad.
A semiconductor chip comprising:
- first and second contact pads;
- a first latch circuit connected with said first contact pad;
- a second latch circuit connected with said second contact pads;
- an internal circuit electrically connected with said first and second latch circuits;
- a control circuit controlling data transfer between said first and second latch circuits,
- wherein said internal circuit is responsive to external data received by said first contact pad to output internal circuit output data, and said second latch circuit latches said internal circuit output data, and
- wherein said control circuit controls said first and second latch circuit to transfer said internal circuit output data from said second latch circuit to said first latch circuit.
A manufacture method for semiconductor chips each including:
- first and second contact pads;
- a first latch circuit connected with said first contact pad;
- a second latch circuit connected with said second contact pads;
- an internal circuit electrically connected with said first and second latch circuits;
- and
- a control circuit controlling data transfer between said first and second latch circuits, said method comprising:
- placing a probe on said first contact pad to feed input data to said internal circuit;
- transferring output data generated by said internal circuit to said first latch circuit through said second latch circuit;
- detecting a fault in said semiconductor chip from said output data received from said first latch circuit through said first pad.
Dependencies are inferred from the claim text.