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US 2006/0189767 A1Published application
Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strength
AssigneeDow Corning Corporation
InventorsDorab Bhagwagar, Loren Durfee
Life of this patent
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Abstract
This invention relates to silicone compositions suitable for forming pressure sensitive adhesives. More particularly, the present invention relates to solventless curable PSA compositions suitable for forming pressure sensitive adhesive compositions having improved high temperature cohesive strength while maintaining good tack and adhesive properties.
Claims10
A solventless pressure sensitive adhesive (PSA) comprising (A) 15 to 40 weight percent of at least one organosiloxane polymer having on average at least two aliphatic unsaturations per molecule;
- (B) 50 to 80 weight percent of at least one resin having R3SiO1/2 (M units) and SiO4/2 (Q units) where each R is an independently chosen monovalent hydrocarbon group free from aliphatic unsaturation and comprising 1 to 20 carbon atoms;
- (C) 2 to 7 weight percent of at least one reactive diluent;
- (D) at least one Si—H containing crosslinker comprising an organohydrogensilicon compound having on average at least two silicon bonded hydrogen atoms per molecule;
- (E) at least one hydrosilylation catalyst;
- and (F) optionally at least one inhibitor.
2 more elements
(canceled)
Dependencies are inferred from the claim text.