Curable resin composition and cold-setting adhesive

A curable resin composition, comprising:

• a curable resin intramolecularly having:
• a silicon-containing functional group represented by general formula:
• —SiR1X1X2 (wherein X1 and X2 respectively represent a hydrolytic group and may be the same as or different from each other, and R1 represents a substituted or unsubstituted organic group having 1 to 20 carbons);
• and at least one polar component selected from the group consisting of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups;
• and
• a Lewis acid or a complex of the Lewis acid, the Lewis acid being selected from the group consisting of metal halides and boron halides.

A cold-setting adhesive, comprising:

• a curable resin having a silicon-containing functional group represented by general formula:
• —SiX1X2X3 (wherein, X1, X2 and X3 respectively represent a hydrolytic group and may be the same as or different from each other);
• and
• a Lewis acid or a comples of the Lewis acid, the Lewis acid being selected from the group consisting of metal halides and boron halides.