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US 2006/0189722 A1Published application
Use of aramid fiber conjunction with thermoplastic to improve wash-off resistance and physical properties such as impact and expansion
AssigneeDow Global Technologies LLC
InventorJihong Kye
Life of this patent
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Abstract
One-part epoxy adhesive formulations, and methods of using the same, are described. The formulations include, among other things, powdered methacrylate butadiene styrene and aramid pulp to, among other things, improve the wash off resistance, T peel strength, and impact strength characteristics thereof. Additionally, the formulations exhibit desirable expansion characteristics. The formulations are especially suitable for use in joining automotive components.
Claims28
A one-part epoxy adhesive formulation, comprising:
- a fiber pulp, wherein the fiber pulp is comprised of an amine-based material;
- and
- an impact modifier, wherein the impact modifier is comprised of a material selected from the group consisting of methacrylate butadiene styrene copolymer, carboxyl terminated butadiene/acrylonitrile copolymer, and combinations thereof.
A one-part epoxy adhesive formulation, comprising:
- a fiber pulp, wherein the fiber pulp is comprised of an aramid-based material;
- and
- an impact modifier, wherein the impact modifier is comprised of a material selected from the group consisting of methacrylate butadiene styrene copolymer, carboxyl terminated butadiene/acrylonitrile copolymer, and combinations thereof.
A one-part epoxy adhesive formulation, comprising:
- a fiber pulp, wherein the fiber pulp is comprised of an aramid-based material, wherein the fiber pulp is present in an amount in the range of about 0.4 to about 2 weight percent based on the total weight of the one-part epoxy adhesive formulation;
- and
- an impact modifier, wherein the impact modifier is comprised of a material selected from the group consisting of methacrylate butadiene styrene copolymer, carboxyl terminated butadiene/acrylonitrile copolymer, and combinations thereof, wherein the impact modifier is present in an amount in the range of about 5 to about 16 weight percent based on the total weight of the one-part epoxy adhesive formulation.
Dependencies are inferred from the claim text.