US 2006/0189261 A1 · Shaped polishing pads for beveling microfeature workpiece edges, and associated systems and methods

Abstract

Systems and methods for beveling microfeature workpiece edges are disclosed. A system in accordance with one embodiment is configured to remove material from a microfeature workpiece having a first face, a second face facing opposite from the first face, an edge surface between the first and second faces, and an edge at a juncture between the edge surface and one of the first and second faces. The system can include a carrier positioned to carry the workpiece with the first and second faces generally normal to an axis, and a first polishing pad having a support surface and a polishing surface facing generally away from the support surface. The polishing surface can have a first shape with at least one portion oriented at an acute angle relative to the axis and the support surface to remove material from the edge of the workpiece. A polishing pad support is positioned to carry the first polishing pad proximate to the carrier and is also configured to carry a second polishing pad having a polishing surface with a second shape configured to remove material from the first face of the workpiece while the workpiece rotates about the axis.

Claims11

Dependent claims

1-58. (canceled)

A method for removing material from a microfeature workpiece, comprising:

carrying a microfeature workpiece having a first face, a second face facing generally opposite from the first face, an edge surface between the first and second faces, and an edge at a juncture between the edge surface and one of the first and second faces;
contacting the edge of the microfeature workpiece with a first polishing surface of an at least partially compliant polishing pad material while the first polishing surface is non-parallel to the first face;
removing material from the edge of the microfeature workpiece by rotating at least one of the microfeature workpiece and the polishing pad material relative to the other about an axis generally normal to the first face of the microfeature workpiece while the edge contacts the polishing surface;
contacting the first face of the microfeature workpiece with a second polishing surface of an at least partially compliant polishing pad material while the second polishing surface is parallel to the first face;
and
removing material from the first face of the microfeature workpiece by rotating at least one of the microfeature workpiece and the polishing pad material relative to the other about an axis generally normal to the first face of the microfeature workpiece while the first face contacts the second polishing surface.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

11/413,372Filed 27 Apr 2006

Priority

6 Aug 2004

Published

24 Aug 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification5 codes

B24B 37/26
Lapping pads for working plane surfaces: characterised by the shape of the lapping pad surface, e.g. grooved
B24B 9/065
Of non-metallic inorganic material, e.g. stone, ceramics, porcelain: of thin, brittle parts, e.g. semiconductors, wafers
Y10S 451/921
Abrading: pad for lens shaping tool
B24B
Machines, devices, or processes for grinding or polishing

Shaped polishing pads for beveling microfeature workpiece edges, and associated systems and methods

Life of this patent

Shaped polishing pads for beveling microfeature workpiece edges, and associated systems and methods

Life of this patent

Abstract

Claims11