Systems and methods for wafer polishing
AssigneeLSI Logic Corporation
InventorRobert Donis
Life of this patent
Estimating the term…
Abstract
An electromagnetic polish head (100) comprises at least one electromagnet. An embodiment may also include the addition of a slurry component or components that can be affected by an electromagnetic field. During polishing or planarization, a field or fields may be generated by the polish head (100) to affect the polishing of a wafer by attracting or repelling the slurry to a portion or portions of the substrate.
Claims24
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
A chemical mechanical polishing system for polishing a substrate comprising:
- a slurry with at least one component capable of being affected by an electromagnetic field;
- a polish head comprising at least one electromagnet for generating an electromagnetic field to affect the slurry's distribution across at least a portion on of the substrate's surface, wherein the electromagnetic field affects a rate of polishing on at least a portion of the substrate by attracting slurry to said at least a portion of the substrate;
- and
- a controller for controlling the electromagnetic field generated by the electromagnet.
A chemical mechanical polishing system for polishing a substrate comprising:
- a slurry with at least one component capable of being affected by an electromagnetic field,
- a polish head comprising at least one electromagnet for generating an electromagnetic field to affect the slurry's distribution across at least a portion of the substrate's surface, wherein the electromagnetic field affects the a rate of polishing on at least a portion of the substrate by repelling slurry from said at least a portion of the substrate;
- and
- a controller for controlling the electromagnetic field generated by the electromagnet.
A method for affecting the polishing rate on at least a portion of a substrate comprising:
- using a slurry with at least one component capable of being affected by a electromagnetic field;
- placing the substrate on a polish head comprising an electromagnet;
- and
- using the electromagnet to generate an electromagnetic field to affect the slurry's distribution across at least a portion of the substrate's surface.
Dependencies are inferred from the claim text.