Edge connector including internal layer contact, printed circuit board and electronic module incorporating same

A printed circuit board, comprising:

• a substrate including a plurality of conductive layers electrically insulated from each other and further including a first major exterior surface, a second major exterior surface, and a minor exterior surface substantially orthogonal to at least one of the first and second major exterior surfaces;
• a plurality of integrated circuit pads formed on the substrate for electrically interfacing with at least one integrated circuit;
• and
• an edge connector formed on one edge of the substrate, the edge connector including:
• at least one of an at least one first conductive contact affixed to the first major exterior surface conductively coupled to one of the plurality of conductive layers and an at least one second conductive contact affixed to the second major exterior surface conductively coupled to another one of the plurality of conductive layers;
• and
• at least one third conductive contact conductively coupled to at least a portion of a first internal conductive layer of the substrate, the at least one third conductive contact configured off-plane from the minor exterior surface, wherein at least a portion of the substrate extends outward from the minor exterior surface and the at least one third conductive contact is affixed thereon.

An electronic module, comprising:

• a printed circuit board, including:
• a substrate including a first major exterior surface, a second major exterior surface, and a minor exterior surface substantially orthogonal to at least one of the first and second major exterior surfaces;
• a plurality of integrated circuit pads formed on the substrate for electrically interfacing with at least one integrated circuit;
• and <an edge connector formed on one edge of the substrate, the edge connector including:
• at least one of an at least one first conductive contact affixed to the first major exterior surface and an at least one second conductive contact affixed to the second major exterior surface;
• and
• at least one third conductive contact conductively coupled to at least a portion of a first internal conductive layer electrically insulated from the first and second major exterior surfaces of the substrate, the at least one third conductive contact configured off-plane from the minor exterior surface, wherein at least a portion of the substrate extends outward from the minor exterior surface and the at least one third conductive contact is affixed thereon;
• at least one integrated circuit attached to the substrate and electrically coupled to one of the at least one of the first, second and third conductive contacts.

An electronic system, comprising:

• a processor;
• at least one of an input device, output device, storage device, and electronic module operationally coupled to the processor;
• and
• wherein at least one of the at least one input device, output device, storage device, and electronic module includes at least one edge connector formed on one end of a substrate including a first major exterior surface, a second major exterior surface and a minor exterior surface substantially orthogonal to at least one of the first and second major exterior surfaces, the edge connector including:
• at least one of an at least one first conductive contact affixed to the first major exterior surface and an at least one second conductive contact affixed to the second major exterior surface;
• and
• at least one third conductive contact conductively coupled to at least a portion of a first internal conductive layer electrically insulated from the first and second major exterior surfaces of the substrate, the at least one third conductive contact configured off-plane from the minor exterior surface, wherein at least a portion of the substrate extends outward from the minor exterior surface and the at least one third conductive contact is affixed thereon.