Method and apparatus for treating organosiloxane coating film
AssigneeTokyo Electron Limited
InventorShingo Hishiya
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Abstract
A method for processing an organosiloxane film includes loading a target substrate (W) with a coating film formed thereon into a reaction chamber (2), and performing a heat process on the target substrate (W) within the reaction chamber (2) to bake the coating film. The coating film contains a polysiloxane base solution having an organic functional group. The heat process includes a temperature setting step of setting an interior of the reaction chamber (2) at a process temperature by heating, and a supplying step of supplying a baking gas into the reaction chamber (2) set at the process temperature, while activating the baking gas by a gas activation section (14) disposed outside the reaction chamber (2).
Claims13
A method for processing an organosiloxane film, the method comprising:
- loading a target substrate with a coating film formed thereon into a reaction chamber, the coating film comprising a polysiloxane base solution having an organic functional group;
- and
- performing a heat process on the target substrate within the reaction chamber to bake the coating film,
- wherein the heat process comprises
- a temperature setting step of setting an interior of the reaction chamber at a process temperature by heating, and
- a supplying step of supplying a baking gas into the reaction chamber set at the process temperature, while activating the baking gas by a gas activation section disposed outside the reaction chamber.
An apparatus for processing an organosiloxane film, by performing a heat process on a target substrate with a coating film formed thereon to bake the coating film, the coating film comprising a polysiloxane base solution having an organic functional group, the apparatus comprising:
- a reaction chamber configured to accommodate the target substrate;
- a temperature adjusting section configured to adjust temperature inside the reaction chamber;
- a gas supply section configured to supply a baking gas into the reaction chamber;
- a gas activation section disposed outside the reaction chamber and configured to activate the baking gas;
- an exhaust section configured to exhaust gas inside the reaction chamber;
- and
- a control section configured to control the temperature adjusting section, the gas supply section, the gas activation section, and the exhaust section.
Dependencies are inferred from the claim text.