Back to results
US 2006/0189140 A1Published application
Insulated pad conditioner and method of using same
Assignee3M Innovative Properties Company
InventorsGary Palmgren, Brian Goers, Douglas Pysher
Life of this patent
Estimating the term…
Abstract
A wafer planarization process with a conditioning tool having an electrical insulator that electrically insulates the abrasive surface of the conditioning tool. The electrical insulator extends the useful life of the abrasive surface of the conditioning tool by reducing the level of electrochemically driven corrosion.
Claims12
A wafer planarization system comprising:
- an electrical source having a first electrode and a second electrode;
- a polishing pad carrier connected to said first electrode;
- a workpiece carrier connected to said second electrode;
- a conditioning tool comprising an abrasive surface adapted to condition said polishing pad;
- and
- an electrical insulator configured to isolate said abrasive surface from at least one of said first electrode and said second electrode.
3 more elements
A method of conditioning an electrochemical-mechanical polishing pad comprising:
- electrically insulating an abrasive surface of a conditioning tool;
- contacting said abrasive surface with said polishing pad;
- and
- moving said abrasive surface relative to said polishing pad.
1 more element
Dependencies are inferred from the claim text.