Method for applying metal features onto barrier layers using ion permeable barriers

A method for forming a metallized feature on a surface of a microelectronic workpiece, comprising steps for:

• providing a microelectronic workpiece including a barrier layer;
• contacting a surface of the barrier layer with an electrolyte solution;
• applying electrical power to the barrier layer and an electrode in contact with the electrolyte solution to produce an electrolytically treated surface of the barrier layer without depositing metal onto the barrier layer;
• contacting a portion of the electrolytically treated surface of the barrier layer with a first processing fluid, the first processing fluid comprising first processing fluid species including a cation, an anion, and a complexing agent;
• contacting a counter electrode with a second processing fluid;
• producing an electrochemical reaction at the counter electrode;
• and
• substantially preventing movement of ionic species between the first processing fluid and the second processing fluid species.

A method for forming a metallized feature on a surface of a microelectronic workpiece, comprising steps for:

• providing a microelectronic workpiece including a barrier layer;
• electrochemically depositing a metal alloy onto the barrier layer;
• contacting a portion of the metal alloy deposited onto the barrier layer with a first processing fluid, the first processing fluid comprising first processing fluid species including a cation, an anion, and a complexing agent;
• contacting a counter electrode with a second processing fluid;
• producing an electrochemical reaction at the counter electrode;
• and
• substantially preventing movement of ionic species between the first processing fluid and the second processing fluid species.