Method of making reinforced semiconductor package

A method of forming a semiconductor device, comprising the steps of:

• providing a plurality of conductive metal tabs;
• positioning a first end of the tabs in a first section of a mold chase;
• positioning a second section of the mold chase over a second end of the tabs, wherein the tabs are anchored between the first and second mold chases;
• loading the first and second mold chases into a molding system;
• performing a molding operation, wherein a plastic mold compound is formed around the metal tabs, thereby forming an interconnect tablet;
• removing the first and second mold chases from the molding system and removing the interconnect tablet from the first and second mold chases;
• performing a surface finishing operation on the interconnect tablet such that the first and second tab ends are generally coplanar with the plastic mold compound on top and bottom surfaces of the interconnect tablet;
• attaching an integrated circuit to the top surface of the interconnect tablet;
• and
• electrically coupling the integrated circuit to the metal tabs of the interconnect tablet.

A method of forming a semiconductor device, comprising the steps of:

• providing a plurality of conductive metal tabs;
• positioning a first end of the tabs in a first section of a mold chase;
• positioning a second section of the mold chase over a second end of the tabs, wherein the tabs are anchored between the first and second mold chases;
• loading the first and second mold chases into a molding system;
• performing a molding operation, wherein a plastic mold compound is formed around the metal tabs, thereby forming an interconnect tablet;
• removing the first and second mold chases from the molding system and removing the interconnect tablet from the first and second mold chases;
• performing a surface finishing operation on the interconnect tablet such that the first and second tab ends are generally coplanar with the plastic mold compound on top and bottom surfaces of the interconnect tablet;
• attaching an integrated circuit to the top surface of the interconnect tablet;
• electrically coupling the integrated circuit to the metal tabs of the interconnect tablet;
• and
• encapsulating the integrated circuit, electrical connections, and at least the top surface of the interconnect tablet with an encapsulant.