Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
AssigneeSeiko Epson Corporation
InventorsTakuya Takahashi, Hiroyuki Tomimatsu
Life of this patent
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Abstract
A tip of a first wire is bonded to a first electrode. The first wire is drawn from the first electrode to a bump on a second electrode. A part of the first wire is deformed and bonded to the bump. A tip of a second wire formed in the shape of a ball is bonded to the bump by using a tool in a state in which at least a part of the tip is superposed on the first wire. A part of the first wire which is not deformed by bonding is prevented from being deformed by the tip of the second wire and the tool.
Claims18
A method of manufacturing a semiconductor device, comprising:
- (a) bonding a first tip of a first wire to a first electrode;
- (b) drawing the first wire from the first electrode to a bump on a second electrode;
- (c) bonding a part of the first wire to the bump by deforming the part of the first wire;
- and
- (d) bonding a second tip of a second wire formed in a shape of a ball to the bump by using a tool in a state in which at least a part of the second tip of the second wire is superposed on the first wire,
- the bonding step being performed without causing a deformation to a part of the first wire that is not deformed by bonding by the second tip of the second wire and the tool in the step (d).
A semiconductor device manufactured by using a method comprising:
- (a) bonding a first tip of a first wire to a first electrode;
- (b) drawing the first wire from the first electrode to a bump on a second electrode;
- (c) bonding a part of the first wire to the bump by deforming the part of the first wire;
- and
- (d) bonding a second tip of a second wire formed in a shape of a ball to the bump by using a tool in a state in which at least a part of the second tip of the second wire is superposed on the first wire,
- the bonding step being performed without causing a deformation to a part of the first wire that is not deformed by bonding by the second tip of the second wire and the tool in the step (d).
A circuit board having a semiconductor device mounted on the circuit board, the semiconductor device being manufactured by using a method comprising:
- (a) bonding a first tip of a first wire to a first electrode;
- (b) drawing the first wire from the first electrode to a bump on a second electrode;
- (c) bonding a part of the first wire to the bump by deforming the part of the first wire;
- and
- (d) bonding a second tip of a second wire formed in a shape of a ball to the bump by using a tool in a state in which at least a part of the second tip of the second wire is superposed on the first wire,
- the bonding step being performed without causing a deformation to a part of the first wire that is not deformed by bonding by the second tip of the second wire and the tool in the step (d).
Electronic equipment having a semiconductor device manufactured by using a method comprising:
- (a) bonding a first tip of a first wire to a first electrode;
- (b) drawing the first wire from the first electrode to a bump on a second electrode;
- (c) bonding a part of the first wire to the bump by deforming the part of the first wire;
- and
- (d) bonding a second tip of a second wire formed in a shape of a ball to the bump by using a tool in a state in which at least a part of the second tip of the second wire is superposed on the first wire,
- the bonding step being performed without causing a deformation to a part of the first wire that is not deformed by bonding by the second tip of the second wire and the tool in the step (d).
Dependencies are inferred from the claim text.