Process for treating substrates for the microelectronics industry, and substrates obtained by this process
AssigneeS.O.I.Tec Silicon on Insulator Technologies
InventorsThierry Barge, Andre Auberton-Herve, Hiroji Aga, Naoto Tate
Life of this patent
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Abstract
A process for treating substrates for the microelectronics or optoelectronics industry, wherein the substrates include on at least one of their faces a working layer in which components are intended to be formed. The process includes a step of annealing under a reductive atmosphere followed by a step of chemical-mechanical polishing on the free surface of the working layer.
Claims15
1-13. (canceled)
A process for treating microelectronic or optoelectronic substrates that have a working layer with a rough free surface thereof created by a layer transfer technique, which process comprises the steps of annealing the substrate and rough free surface under a reductive atmosphere for a sufficient time and at a temperature sufficient to assist in smoothing of the free surface, followed by chemical mechanical polishing of the free surface sufficient to form a polished working layer surface having a reduced rms roughness so that the substrate and working layer are ready for further processing steps.
Dependencies are inferred from the claim text.