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US 2006/0189100 A1Published application
Method for cutting a wafer using a protection sheet
AssigneeTDK Corporation
InventorMasaharu Ishizuka
Life of this patent
Estimating the term…
Abstract
The method for dicing a wafer comprising the steps of: reducing a thickness of a wafer to at least 0.1 mm or less; forming a protection sheet tightly on one side of the wafer, the protection sheet having a Vickers hardness of 2 or more; and dicing the wafer by a grindstone, the wafer having the protection sheet thereon.
Claims12
A method for dicing a wafer comprising the steps of:
- reducing a thickness of a wafer to at least 0.1 mm or less;
- forming a protection sheet tightly on one side of said wafer, said protection sheet having a Vickers hardness of 2 or more;
- and
- dicing said wafer by a grindstone, said wafer having said protection sheet thereon.
1 more element
4 The method for dicing a wafer according to claim 2,
- wherein, said step for applying the film comprises the steps of:
- forming the film which consists of thermosetting resin on said wafer:
- and
- attaching said wafer to a processing tape having a stacked structure consisting of a base material and a resin film, said wafer having said film which consists of thermosetting resin formed thereon, wherein a side of said wafer on which the film which consists of the thermosetting resin is formed and a side of said processing tape on which the resin film is formed are tightly attached.
1 more element
9 The method for dicing a wafer according to claim 7,
- wherein, said step for applying the film comprises the steps of:
- forming the film which consists of ultraviolet curing resin on said wafer:
- and
- attaching said wafer to a processing tape having a stacked structure consisting of a base material and a resin film, said wafer having said film which consists of ultraviolet curing resin formed thereon, wherein a side of said wafer on which the film which consists of the ultraviolet curing resin is formed and a side of said processing tape on which the resin film is formed are tightly attached.
1 more element
Dependencies are inferred from the claim text.