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US 2006/0189076 A1Published application
Semiconductor device and manufacturing method thereof
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorSetsuo Nakajima
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Abstract
In a thin film transistor, a metallic element promoting crystallization of an amorphous silicon film is effectively removed and the productivity is improved. By using a silicon film containing an element belonging to the group 15 such as phosphorus through contact holes reaching a source region and a drain region, a metallic element promoting crystallization of an amorphous silicon film can be effectively removed or decreased and the productivity can be improved.
Claims1
A method of manufacturing a semiconductor device comprising the steps of:
- forming a base insulating film on a substrate;
- forming an amorphous semiconductor film on the base insulating film;
- doping a metallic element promoting crystallization of the amorphous semiconductor film and crystallizing the amorphous semiconductor film to form a crystalline semiconductor film;
- forming a gate insulating film on the crystalline semiconductor film;
- forming a gate electrode on the gate insulating film;
- doping an impurity element in a selected region of the crystalline semiconductor film to form a source region and a drain region;
- forming an interlayer insulating film on the gate electrode;
- forming a contact hole in the interlayer insulating film, the contact hole reaching the source region or the drain region;
- forming a film containing an impurity element belonging to the group 15 of the periodic table in the contact hole reaching the source region or the drain region and on the interlayer insulating film;
- gettering by thermal annealing the metallic element contained in the crystalline semiconductor film;
- and
- forming a conductive film on the film containing an impurity element belonging to the group 15 of the periodic table.
9 more elements
Dependencies are inferred from the claim text.