High reliability multilayer circuit substrates and methods for their formation
AssigneeMedtronic MiniMed, Inc.
InventorsRajiv Shah, Shaun Pendo
Life of this patent
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Abstract
A multilayer circuit substrate for multi-chip modules or hybrid circuits includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by shadow mask techniques. Substrates formed in this manner enable significant increases in interconnect density and significant reduction of over-all substrate thickness.
Claims24
A method for forming a multilayer circuit substrate, comprising:
- providing a base substrate;
- forming conductors on the base substrate;
- forming sacrificial structures on the base substrate and conductors to define areas to be protected from deposition of a dielectric layer;
- vacuum depositing a dielectric thin film on the base substrate, the conductors and the sacrificial structures;
- and
- removing the sacrificial structures to leave a patterned deposited dielectric thin film on the conductors and the base substrate.
(canceled)
14-26. (canceled)
A multilayer circuit substrate, comprising:
- a dielectric base substrate;
- a conductor formed on the base substrate;
- and
- a patterned vacuum deposited dielectric thin film formed on the base substrate and the conductor.
Dependencies are inferred from the claim text.