Method of manufacturing an electronic device
AssigneeHitachi, Ltd.
InventorMitsuo Usami
Life of this patent
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Abstract
The existing IC cards have a disadvantage of difficulty of mass production because an IC chip is supplied on a substrate one at a time. The present invention provides a method of manufacturing by placing a positioning jig having a plurality of openings each of which has a size fit with a semiconductor device, providing a plurality of semiconductor devices on said jig to house the devices into the openings, and fixing on a substrate then cutting the substrate to provide independent electronic devices. When the semiconductor device is in a form of chip, a support member attached to the chip will facilitate the handling of chips.
Claims2
A method of manufacturing an electronic device, comprising the steps of:
- providing a semiconductor substrate including a plurality of semiconductor devices each having an antenna, and a thickness equal to or less than 30 micrometers;
- providing photosensitive material to the part corresponding to said semiconductor devices on the backside of said semiconductor substrate to form a support member of said semiconductor devices;
- separating said semiconductor devices each having said support member into a plurality of semiconductor chips;
- providing a substrate;
- providing a jig having a plurality of openings, each of which openings has a size corresponding to one of said semiconductor chips;
- placing said jig on said substrate;
- providing a plurality of said semiconductor chips to said jig to house said semiconductor chips into a plurality of said openings;
- and
- fixing said semiconductor chips onto said substrate.
A method of manufacturing an electronic device, comprising the steps of:
- adding support material on a topside or backside of semiconductor chips;
- registering with another film base substrate;
- and
- processing to melt said support material to flow said support material around said semiconductor chips,
- wherein said support material is formed by applying photosensitive material on an entire surface of a semiconductor wafer prior to separating the chips, by exposing said photosensitive material with a photomask and light beam, and by developing.
Dependencies are inferred from the claim text.