# US 2006/0189038 A1 · Semiconductor component and method of manufacture

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- Number: US 2006/0189038 A1
- Document ID: US20060189038A1
- Status: Published application
- Kind: A1
- Application number: 11/327,552
- Filed: 2006-01-06
- Published: 2006-08-24
- Earliest claimed: 2005-01-10
- Assignees: HVVi Semiconductors, Inc.
- Inventors: Jeanne Pavio
- Web page: https://patentgrep.com/patent/US20060189038A1

## CPC

- H10W 40/251: {Organics}
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 76/134: having other interconnections parallel to the conductive base
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 72/0198: {batch processes}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07336: {Soldering or alloying}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/354: {comprising polymers}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 72/90: Bond pads, in general
- H10W 72/923: {Bond pads having multiple stacked layers}
- H10W 72/9415: {relative to the surface, e.g. recessed, protruding}
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 76/17: characterised by their materials
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- Y10T 29/49121: Beam lead frame or beam lead device
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A semiconductor component having a semiconductor chip mounted on a packaging substrate and a method for manufacturing the semiconductor component that uses batch processing steps for fabricating the packaging substrate. A heatsink is formed using an injection molding process. The heatsink has a front surface for mating with a semiconductor chip and a leadframe assembly. The heatsink also has a back surface from which a plurality of fins extend. The leadframe assembly includes a leadframe having leadframe leads extending from opposing sides of the leadframe to a central area of the leadframe. A liquid crystal polymer is disposed in a ring-shaped pattern on the leadframe leads. The liquid crystal polymer is partially cured. The leadframe assembly is mounted on the front surface of the heatsink and the liquid crystal polymer is further cured to form a packaging assembly, which is then singulated into packaging substrates.

## Claims

### Claim 1

A method for manufacturing a semiconductor component, comprising the steps of:
providing a heatsink having first and second major surfaces;
providing a leadframe having at least one leadframe lead;
disposing a liquid crystal polymer on a portion of the at least one leadframe lead;
partially curing the liquid crystal polymer; and
mating the liquid crystal polymer and the heatsink.

### Claim 2 (depends on 1)

The method of claim 1, wherein the step of providing the heatsink includes providing the heatsink with a platform that serves as a die receiving area.

### Claim 3 (depends on 2)

The method of claim 2, wherein the step of providing the heatsink includes contemporaneously forming the heatsink and the platform using an injection molding process.

### Claim 4 (depends on 1)

The method of claim 1, wherein providing the heatsink includes forming at least one fin extending from the second major surface of the heatsink.

### Claim 5 (depends on 4)

The method of claim 4, wherein the step of forming the at least one fin includes forming the at least one fin to have a quadrilateral shape.

### Claim 6 (depends on 5)

The method of claim 5, wherein forming the at least one fin comprises forming at least three fins, wherein each of the at least three fins has a quadrilateral shape and are substantially parallel to each other.

### Claim 7 (depends on 6)

The method of claim 6, wherein forming the at least one fin includes forming the at least one fin to have a pyramidal shape.

### Claim 8 (depends on 1)

The method of claim 1, further including the step of further curing the liquid crystal polymer after mating the liquid crystal polymer and the heatsink.

### Claim 9 (depends on 8)

The method of claim 8, wherein the step of disposing the liquid crystal polymer on the portion of the at least one leadframe lead includes dispensing the liquid crystal polymer on the at least one portion of the leadframe lead.

### Claim 10 (depends on 8)

The method of claim 8, wherein the step of further curing the liquid crystal polymer includes fully curing the liquid crystal polymer.

### Claim 11 (depends on 8)

The method of claim 8, wherein the step of providing the heatsink includes forming the heatsink using an injection molding process.

### Claim 12 (depends on 8)

The method of claim 8, wherein the step of providing a leadframe having at least one leadframe lead includes providing a leadframe having first and second opposing sides spaced apart from each other by a central area, wherein a first leadframe lead extends from the first side into the central area and a second leadframe lead extends from the second side into the central area.

### Claim 13 (depends on 12)

The method of claim 12, wherein the step of disposing the liquid crystal polymer includes disposing the liquid crystal polymer in a ring-shaped pattern having first and second opposing sides and third and fourth opposing sides, and wherein the first side of the ring-shaped pattern is disposed on the first leadframe lead and the second side of the ring-shaped pattern is disposed on the second leadframe lead.

### Claim 14 (depends on 13)

The method of claim 13, wherein the first side of the ring-shaped pattern is disposed on a central portion of the first leadframe lead and the second side of the ring-shaped pattern is disposed adjacent an end of the ring-shaped pattern.

### Claim 15 (depends on 8)

The method of claim 8, wherein the step of providing a leadframe having at least one leadframe lead includes providing a leadframe having first and second opposing sides spaced apart from each other by a central area, wherein a plurality of leadframe leads extends from the first side into the central area and a plurality of lead extends from the second side into the central area.

### Claim 16 (depends on 15)

The method of claim 15, wherein the step of disposing the liquid crystal polymer includes disposing the liquid crystal polymer in a ring-shaped pattern having first and second opposing sides and third and fourth opposing sides, and wherein the first side of the ring-shaped pattern is disposed on the plurality of leadframe leads extending from the first side of the leadframe and the second side of the ring-shaped pattern is disposed on the plurality of leadframe leads extending from the second side of the leadframe.

### Claim 17 (depends on 16)

The method of claim 16, wherein the step of providing a leadframe having at least one leadframe lead includes providing the leadframe having third and fourth opposing sides spaced apart from each other by the central area, wherein a plurality of leadframe leads extends from the third side into the central area and a plurality of leadframe leads extends from the fourth side into the central area, and wherein the step of disposing the liquid crystal polymer includes disposing the third side of the ring-shaped pattern on the plurality of leadframe leads extending from the third side and disposing the fourth side of the ring-shaped pattern on the plurality of leadframe leads extending from the fourth side.

### Claim 18 (depends on 8)

The method of claim 8, further including the steps of:
providing a semiconductor chip having first and second major surfaces, wherein a gate structure is formed over the first major surface; and
coupling the first major surface of the semiconductor chip with the first major surface of the heatsink.

### Claim 19 (depends on 18)

The method of claim 18, wherein the step of providing the semiconductor chip includes forming a metallization system on the first major surface of the semiconductor chip and wherein the step of coupling the first major surface of the semiconductor chip with the first major surface of the heatsink comprises soldering the semiconductor chip to the first major surface of the heatsink.

### Claim 20 (depends on 19)

The method of claim 19, wherein the metallization system comprises one of a tin-nickel-gold metallization system or a tin-nickel-silver metallization system.

### Claim 21 (depends on 18)

The method of claim 18, further including coupling a metal clip to the second side of the semiconductor chip and to a first leadframe lead of the plurality of leadframe leads.

### Claim 22 (depends on 21)

The method of claim 21, further including the step of placing a lid over the semiconductor chip, wherein a portion of the lid is coupled to the metal clip.

### Claim 23 (depends on 21)

The method of claim 21, wherein the step of providing the semiconductor chip includes forming a metallization system on the second major surface of the semiconductor chip and soldering the metal clip to the metallization system on the second major surface of the semiconductor chip.

### Claim 24 (depends on 23)

The method of claim 23, wherein the metallization system on the second major surface of the semiconductor chip comprises aluminum with a nickel-gold alloy disposed thereon.

### Claim 25 (depends on 18)

The method of claim 18, further including electrically coupling the gate structure to a second leadframe lead of the plurality of leadframe leads.

### Claim 26 (depends on 25)

The method of claim 25, further including the step of soldering the lid to the semiconductor chip.

### Claim 27 (depends on 8)

The method of claim 8, further including the step of coupling at least one other semiconductor chip to the heatsink.

### Claim 28 (depends on 27)

The method of claim 27, wherein the step of coupling the at least one other semiconductor chip to the heatsink includes coupling a switching chip to the heatsink and coupling a mixed signal integrated circuit to the heatsink.

### Claim 29

A method for manufacturing a semiconductor component, comprising the steps of:
forming a plurality of heatsinks, each heatsink of the plurality of heatsinks having first and second major surfaces;
providing a leadframe having a plurality of leadframe leads;
disposing a liquid crystal polymer on the plurality of leadframe leads;
partially curing the liquid crystal polymer;
coupling the leadframe to the plurality of heatsinks through the partially cured liquid crystal polymer to form a packaging frame comprising a plurality of packaging substrates; and
singulating the packaging frame to separate the plurality of packaging substrates from each other.

### Claim 30 (depends on 29)

The method of claim 29, wherein the step of forming the heatsink comprises using an injection molding process.

### Claim 31 (depends on 30)

The method of claim 30, wherein the step of forming the heatsink comprises forming the heatsink having a quadrilateral shape.

### Claim 32 (depends on 30)

The method of claim 30, wherein the step of disposing the liquid crystal polymer on the plurality of leadframe leads comprises disposing the liquid crystal polymer in a quadrilateral ring-shaped pattern.

### Claim 33 (depends on 29)

The method of claim 29, further including the step of further curing the liquid crystal polymer.

### Claim 34 (depends on 33)

The method of claim 33, further including coupling a semiconductor chip to the heatsink, electrically coupling the semiconductor chip to at least one leadframe lead of the plurality of leadframe leads, and disposing a glob top material over the semiconductor chip.

### Claim 35

A method for manufacturing a semiconductor component, comprising the steps of:
providing a heatsink having first and second major surfaces;
providing a ball grid array substrate having a first major surface and a second major surface, the second major surface having solder balls coupled thereto;
disposing a liquid crystal polymer on a portion of the first major surface of the ball grid array substrate;
partially curing the liquid crystal polymer;
mating a first major surface of a semiconductor chip to the liquid crystal polymer; and
mating a second major surface of the semiconductor chip to the heatsink.

### Claim 36 (depends on 35)

The method of claim 35, wherein providing the heatsink includes providing fins extending from the second major surface of the heatsink.

### Claim 37 (depends on 36)

The method of claim 36, wherein partially curing the liquid crystal polymer includes partially curing the liquid crystal polymer at a temperature ranging from about 260° C. to about 280° C. for a time ranging from about 20 minutes to about 60 minutes.

### Claim 38 (depends on 37)

The method of claim 37, further including curing the liquid crystal polymer after the step of mating the first major surface of a semiconductor chip to the liquid crystal polymer.

### Claim 39

A semiconductor component, comprising:
a heatsink having first and second major surfaces;
a liquid crystal polymer disposed on the first major surface of the heatsink, the liquid crystal polymer having a first side;
first and second leadframe leads disposed on first and second portions of the liquid crystal polymer, respectively;
a semiconductor chip having an active surface and a back surface, the active surface coupled to the heatsink;
an interconnect coupling the semiconductor chip to the first leadframe lead; and
a clip coupling the back surface to the second leadframe lead.

### Claim 40 (depends on 39)

The semiconductor component of claim 39, wherein a portion of the first leadframe lead extends beyond the first side of the liquid crystal polymer.

### Claim 41 (depends on 40)

The semiconductor component of claim 40, wherein the liquid crystal polymer forms a ring-shaped pattern on the first major surface of the heatsink, the ring-shaped pattern comprising first, second, third, and fourth sides, wherein the first and second sides are opposite each other and the third and fourth sides are opposite each other, and wherein the first side includes the first portion of the liquid crystal polymer and the second side includes the second portion of the liquid crystal polymer.

### Claim 42 (depends on 41)

The semiconductor component of claim 41, further including a lid coupled to the first and second leadframe leads through an electrically insulating material.

### Claim 43 (depends on 42)

The semiconductor component of claim 42, wherein the lid contacts the clip.

### Claim 44 (depends on 43)

The semiconductor component of claim 43, further including at least one fin extending from the second major surface of the heatsink.