Integrated circuit package-in-package system
AssigneeSTATS ChipPAC, Ltd.
InventorJong Kook Kim
Life of this patent
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Abstract
A package-in-package system is provided including forming a top substrate having a first integrated circuit electrically connected thereto and mounting a second integrated circuit over the first integrated circuit. The system includes forming first electrical connectors on the second integrated circuit and encapsulating the second integrated circuit in a first encapsulant with the first electrical connectors exposed. The system includes mounting the second integrated circuit over a bottom substrate with the first electrical connectors electrically connected thereto and encapsulating the top substrate and the first encapsulant in a second encapsulant.
Claims20
A package-in-package system comprising:
- forming a top substrate having a first integrated circuit electrically connected thereto;
- mounting a second integrated circuit over the first integrated circuit;
- forming first electrical connectors on the second integrated circuit;
- encapsulating the second integrated circuit in a first encapsulant with the first electrical connectors exposed;
- mounting the second integrated circuit over a bottom substrate with the first electrical connectors electrically connected thereto;
- and
- encapsulating the top substrate and the first encapsulant in a second encapsulant.
A package-in-package system comprising:
- forming a top substrate having a first set of integrated circuits electrically connected by wire bonds thereto;
- mounting a second set of integrated circuits over the first set of integrated circuits;
- forming stud bumps on the second set of integrated circuits;
- encapsulating the second set of integrated circuits in a first encapsulant with the stud bumps exposed;
- flipping the second set of integrated circuits over a bottom substrate to mount the second set of integrated circuits with the stud bumps electrically connected thereto;
- and
- encapsulating the top substrate and the first encapsulant in a second encapsulant.
A package-in-package system comprising:
- a top substrate;
- a first integrated circuit electrically connected to the top substrate;
- a second integrated circuit over the first integrated circuit;
- first electrical connectors on the second integrated circuit;
- a first encapsulant encapsulating the second integrated circuit with the first electrical connectors exposed;
- a bottom substrate having the second integrated circuit electrically connected thereto by the first electrical connectors;
- and
- a second encapsulant encapsulating the top substrate.
A package-in-package system comprising:
- a top substrate;
- a first set of integrated circuits electrically connected by wire bonds to the top substrate;
- a bottom substrate;
- a second set of integrated circuits mounted over the first set of integrated circuits, the second set of integrated circuits having stud bumps thereon and encapsulated in a first encapsulant with the stud bumps exposed, the second set of integrated circuits over the bottom substrate with the stud bumps electrically connected thereto;
- and
- a second encapsulant encapsulating the top substrate and the first encapsulant.
Dependencies are inferred from the claim text.