Process for assembling a double-sided circuit component

A process of producing a double-sided circuit component, the process comprising:

• depositing a solder paste on surfaces of first and second substrate members, each of the first and second substrate members being formed of an electrically-nonconductive material and comprising at least one electrically-conductive area and a plurality of bond pads on which the solder paste is deposited;
• placing the first substrate member within a cavity in a receptacle;
• placing a pair of lead members on the receptacle so that a portion of each of the lead members is individually aligned with one of the bond pads of the first substrate member;
• placing a fixture on the lead members and over the first substrate member so that the fixture is supported by the receptacle;
• aligning a circuit device with the at least one electrically-conductive area of the second substrate member to yield a preliminary assembly;
• placing the preliminary assembly in an aperture in the fixture so that at least one electrode on a first surface of the circuit device electrically contacts the at least one electrically-conductive area of the first substrate member, at least one electrode on a second surface of the circuit device electrically contacts the at least one electrically-conductive area of the second substrate member, and the portions of the lead members are between aligned pairs of the bond pads of the first and second substrates, thereby yielding a fixtured assembly comprising the first and second substrate members, the receptacle, the lead members, the fixture, and the circuit device;
• heating the fixtured assembly to cause the solder paste to melt, flow, and wet the electrically-conductive areas and the bond pads of the first and second substrate members, the portions of the lead members, and the electrodes on the first and second surfaces of the circuit device;
• and then
• cooling the fixtured assembly to yield the double-sided circuit component in which the at least one electrically-conductive area of the first substrate member is solder bonded to the at least one electrode on the first surface of the circuit device, the at least one electrically-conductive area of the second substrate member is solder bonded to the at least one electrode on the second surface of the circuit device, and the portions of the lead members are individually solder bonded to the pairs of the bond pads of the first and second substrate members.