Method of testing FPC bonding yield and FPC having testing pads thereon
AssigneeTPO Displays Corp.
InventorChia-Cheng Lin
Life of this patent
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Abstract
A flexible printed circuit (FPC) having testing pads thereon is provided. The FPC comprises a plurality of bonding pads and a plurality of testing pads, wherein each of the testing pads is disposed corresponding to each of the bonding pads, and the testing pads are electrically isolated from the bonding pads. After the bonding pads of the FPC are bonded to pins of a display, the testing pads are electrically connected to the bonding pads on the FPC via the pins of the display. Therefore, the FPC bonding yield can be determined by measuring the electrical property of the testing pads.
Claims7
1-8. (canceled)
A flexible printed circuit having testing pads, comprising:
- a flexible printed circuit having a plurality of bonding pads thereon;
- and
- a plurality of testing pads disposed on the flexible printed circuit, wherein each of the testing pads is disposed corresponding to each of the bonding pads, and each of the testing pads is electrically isolated from the bonding pads.
14-19. (canceled)
Dependencies are inferred from the claim text.