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US 2006/0189007 A1Published application
Wirebond crack sensor for low-k die
AssigneeInternational Business Machines Corporation
InventorsToyohiro Aoki, Lloyd Burrell, Wolfgang Sauter
Life of this patent
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Abstract
A sensor for measuring cracks in a semiconductor device, such as a wafer and, more particularly, to a BEOL wirebond crack sensor for low-k dies or wafers, and a method of providing the wirebond crack sensor for low-k wafers or the like structures.
Claims18
A sensor structure for measuring damage encountered by a semiconductor device, wherein said sensor structure comprises:
- at least one wirebond sensor including circuitry for determining damage in a low-k die, wafer or pad, said circuitry wirebonding serpentine and comb-like wiring in a dielectric substrate.
A method of providing a sensor structure for measuring damage encountered by a semiconductor device, wherein said method comprises:
- providing at least one wirebond sensor including circuitry for determining damage in a low-k die, wafer or pad, said circuitry wirebonding serpentine and comb-like wiring in a dielectric substrate.
Dependencies are inferred from the claim text.